|
Product Details:
|
| Capacity: | 8GB-512GB | Agreement: | HS400 |
|---|---|---|---|
| Read Speed: | Up To 330MB/s | Write Speed: | Up To 240MB/s |
| Operating Temperature: | -25℃~+85℃ | Choice Of Flash: | MLC/3DTLC/QLC NAND |
| Highlight: | BGA153 EMMC 5.1 16GB Memory Chip,Automotive Grade EMMC 5.1 Memory Chip,Hs400 Standard EMMC 5.1 Memory Chip |
||
| Model | G2564GTLCA | G25128TLCA | G25256TLCA | G25512TLCA |
| NAND flash | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND |
| Capacity | 64GB | 128GB | 256GB | 512GB |
| CE | 1 | 2 | 4 | 4 |
| Read speed | up to 330MB/s | up to 330MB/s | up to 330MB/s | up to 330MB/s |
| Write speed | up to 240MB/s | up to 240MB/s | up to 240MB/s | up to 240MB/s |
| Operating temperature |
-25℃~85℃
|
-25℃~85℃
|
-25℃~85℃
|
-25℃~85℃
|
| EP | ≥3000 | ≥3000 | ≥3000 | ≥3000 |
| Packaging specification | BGA 153 | BGA 153 | BGA 153 | BGA 153 |
| Size | 11.5mmx13mmx1.0mm | 11.5mmx13mmx1.0mm | 11.5mmx13mmx1.2mm | 11.5mmx13mmx1.2mm |
Technical details of eMMC chip
Pin definition
PCB design considerations
Advantages of eMMC chips
Suitability for mobile devices
Data security and reliability
In short, eMMC chips play a crucial role in modern mobile devices due to their high efficiency, reliability and easy integration.
![]()
Contact Person: Mr. Sunny Wu